An Experimental Validation of the Pressure Capacity of a Modular Gasketless Microfludic Interconnect

Fluidic interconnects provide the passages for the transport of liquid analytes, containing mass and information, from one component to another in a microfluidic system. The pressure capacity of a novel, modular, gasketless, chip-to-chip microfluidic interconnect that forms a seal with a liquid bridge suspended between concentric through-holes was evaluated experimentally (see Figure 1). [5] The maximum rupture pressure measured for the gasketless interconnect was 21.4 kPa (3.1 psig), which corresponded to a measured assembly gap distance of 3.4 m. The gasketless interconnect withstood maximum pressures seen in microfluidic systems and is realizable within manufacturing variation.